Thermal Analysis of laminated (Copper – Graphite) as Heat Spreader Material

Copper-Graphite laminate material design has been analysed, and this proposed composite has the ability to enhance heat dispersing more efficiently compared to the traditional high thermal conductivity with weight associated copper and high thermal resistance graphite. A finite element analysis (FEA) is carried out using the material (Cu – Gr) properties to investigate this proof. The design, thermal properties (temperature, total thermal resistance) are compared with existing and proven mathematical model. The dimensionless expression is used to compute the maximum spreading thermal resistance, surface temperature and this is compared with thermally simulated temperature and the total resistance of the spreader material. The performance is tested using length (l), width (w), thickness (t) and the total thermal resistance (R) (Dimensions for material). The results for the thermal conductance of (Cu-Gr) obtained is 2.5 x 105W/ (mK) with negligible error percentage to predict the 2-D design as a suitable heat spreading material.